Multiphysics simulation from ANSYS provides high-fidelity engineering analysis tools that enable the accurate simulation of complex coupled-physics behavior. ANSYS multiphysics solutions combine industry-leading solver technology for all physics disciplines - structural mechanics, heat transfer, fluid flow and electromagnetics - with an open and adaptive ANSYS Workbench environment, flexible coupled-physics simulation methods, and parallel scalability. Together these cutting-edge technologies form the foundation for comprehensive multiphysics simulation capable of solving industry’s most complex engineering challenges.
In an expanding range of simulation examples, engineers and designers must be able to accurately predict how complex products will behave in real-world environments where multiple types of coupled physics interact. Multiphysics simulation software from ANSYS allows users to create virtual prototypes of their designs operating under real-world multiphysics conditions. This industry leading software enables engineers and scientists to simulate the interaction between structural mechanics, heat transfer, fluid flow and electromagnetics all within a single, unified engineering simulation environment.
Multiphysics simulation from ANSYS enables engineers and designers to create virtual prototypes of their designs operating under real-world multiphysics conditions. ANSYS Multiphysics provides to the analysis industry the most advanced coupled physics technology within a unified simulation environment. ANSYS Multiphysics allows engineers and scientists to simulate the interaction between structural mechanics, heat transfer, fluid flow, acoustics and electromagnetics all within a single software product.
Many product designs require the simulation of complex multiphysics behavior. To accurately predict product performance, a simulation tool that enables the solution of complex multiphysics behavior is required. Multiphysics simulation from ANSYS offers industry leading solutions for piezoelectricity, piezoresistivity, electroelasticity, thermoelasticity, thermoelectricity, thermal-electric-structural coupling, induction heating, microwave heating, electromagnetic-structural coupling and fluid structure interaction.